Our Mission
To advance the semiconductor industry through innovative fabrication techniques and unparalleled quality.Our Expertise
With decades of experience, our team specializes in Flip Chip, BGA, MCM, SIP, and Multi-Layer Organic Interposer technologies.Commitment to Quality
We adhere to stringent quality standards, ensuring that every product meets the highest performance criteria.Our Services
Discover the comprehensive suite of fabrication services tailored for the semiconductor industry.
Flip Chip Fabrication
We provide high-quality flip chip packaging solutions that enhance performance and reliability in electronic devices.BGA Solutions
Our BGA services offer superior interconnect reliability and thermal performance for next-generation applications.Multi-Layer Organic Interposers
Advanced multi-layer organic interposer technology enables efficient signal routing and reduced power consumption.Testimonials
Hear directly from our valued clients about their experiences and the impact of our solutions.
Client Satisfaction
Our clients appreciate the quality and reliability of our products, which have consistently met their demanding specifications.Partnership Success
We build strong partnerships with our clients, fostering collaboration that leads to innovative solutions and mutual growth.Industry Recognition
Our work has been recognized across the industry for excellence in fabrication, contributing to our clients' successes.
